Relation Between Temperature Increases (∆T) And Thermal Resistance (Θja) At A Given Ambient; Temperature - Renesas R-IN32M3 Series User Manual

R-IN32M3 Series: Board design edition
Relation between Temperature Increases (∆t) and Thermal Resistance (θja) at a
25.1.5
Given Ambient Temperature
The thermal resistance (θja) depends on the board, casing, and peripheral components. If respective criteria for the
temperature rise (Δt = Tt - Ta) apply to the end product, refer to the graph below that shows the required θja to reach the
target Δt. Take these values into consideration in the thermal design of the board.
As an example, the graph also shows the thermal resistance (actually measured) of the TS-R-IN32M3-CEC board from
Tessera Technology Inc. Measures for heat release as described in 25.2.1, Measures for Heat Release in Designing the
Board, have been applied for this board.
(For reference)
Thermal resistance (actually measured) of the
TS-R-IN32M3-CEC board from Tessera
Technology Inc.
Note. The value for the board manufactured by Tessera Technology Inc. and the result of simulation
under JEDEC-2S2P conditions were obtained without a casing.
R18UZ0021EJ0400
Dec. 28, 2018
Note
Thermal resistance under
JEDEC-2S2P conditions
(simulation)
Δt: Tt – Ta (°C)
Ta: Ambient temperature (°C)
Tt: Package surface temperature (°C)
Note
25. Thermal Design <R>
Ta
Δt
Tt
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