Thermal Resistances Under The Jedec Conditions (For Θja And Ψjt); Results Of Estimating Power Consumption Of The 1-V Sub-Systems At Tj - Renesas R-IN32M3 Series User Manual

R-IN32M3 Series: Board design edition
Thermal Resistances under the JEDEC Conditions (for θja and Ψjt)
25.1.3
The thermal resistances under the JEDEC-2S2P conditions are as follows.
However, these values are for the devices alone; care is required since the actual thermal resistances will depend on the
board, casing, and peripheral components.
R-IN32M3-EC
R-IN32M3-CL
25.1.4

Results of Estimating Power Consumption of the 1-V Sub-Systems at Tj

The results of calculating power consumption by the 1-V sub-systems vary with the effects of θja and Ta on Tj.
(1) R-IN32M3-EC
θja [°C/W]
16.3
Ta [°C]
(JEDEC)
-40
-35
-30
-25
-20
-15
-10
-5
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
R18UZ0021EJ0400
Dec. 28, 2018
Tj [°C]
20 25
-25.9 -22.6 -18.1
-20.8 -17.5 -13.0
-15.7 -12.3
-10.6 -7.2
-5.4 -2.0
-0.3 3.2
4.9 8.4
10.1 13.6
15.3 18.9
20.5 24.2
25.7 29.5
31.0 34.8
36.3 40.2
41.6 45.7
46.9 51.1
52.3 56.7
57.8 62.3
63.2 67.9
68.8 73.7
74.4 79.6
80.1 85.5
85.8 91.6 100.6
91.7 97.9 107.7
97.7 104.3 N/A
103.8 N/A N/A
110.0 N/A N/A
θja [°C/W]
16.3
14.9
Power Consumption by 1-V Sub-Systems [mW]
30 16.3
(JEDEC)
-13.6 205
-8.3 211
-7.8 -3.1 218
-2.5 2.2 225
2.7 7.5 233
8.0 12.9 243
13.3 18.3 252
18.6 23.7 263
24.0 29.2 275
29.4 34.8 289
34.8 40.4 303
40.3 46.0 319
45.9 51.8 337
51.5 57.7 357
57.2 63.7 379
62.9 69.8 403
68.8 76.1 430
74.8 82.5 460
81.0 89.3 493
87.3 96.3 530
93.8 103.8 572
N/A 619
N/A 672
N/A 732
N/A 800
N/A 879
25. Thermal Design <R>
Ψjt [°C/W]
0.10
0.12
20 25
209 214 221
215 222 229
223 230 238
231 238 247
239 248 258
249 259 270
260 271 283
272 284 298
284 298 314
299 314 332
315 332 352
332 352 375
352 374 400
373 399 429
397 427 462
424 458 499
454 493 542
488 533 591
525 579 649
568 631 718
616 692 801
671 763 N/A
734 848 N/A
807 N/A N/A
N/A N/A N/A
N/A N/A N/A
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