Examples Of Measures For Heat Dissipation - Renesas R-IN32M3 Series User Manual

R-IN32M3 Series: Board design edition
25.2

Examples of Measures for Heat Dissipation

We classify measures for heat dissipation into two types. For details, see the following pages.
(1) Measures for heat release in designing the board
• Take these types of measures into consideration when designing the board.
• The following measures are highly effective, so implement them as a matter of course.
(I) Thermal vias
(II) VDD/GND pattern
(III) Increase the number of board layers, and bring the GND pattern out to the surface layer.
(IV) Consider other factors of placement that will affect heat flows and take the appropriate
Note
action
（2） Heat dissipation from the periphery (including the casing)
• If the measures listed in (1) above still don't achieve your criterion for Δt or satisfy the condition Tj
= 110°C or below, further measures for heat dissipation in the form of heat sinks or heat dissipating
gels should be applied, including for the casing as a whole if this is required.
Note. Take special care in placement in terms of the regulator, since this operates at particularly high
temperatures.
R18UZ0021EJ0400
Dec. 28, 2018
25. Thermal Design <R>
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