Notes On Placement Of Peripheral Components; Figure 4.2 Schematic View From Below The Board - Renesas R-IN32M3 Series User Manual

R-IN32M3 Series: Board design edition
4.2

Notes on Placement of Peripheral Components

The 0.1-µF ceramic capacitor (C1) should be placed immediately close to R-IN32M3 (in the immediate vicinity of the
pin).
Figure 4.2 is a schematic view from below the board.
In addition, the wiring patterns for the electrolytic capacitor (C2) and ferrite beads running parallel to other signal lines
should be avoided.
Pay particu lar attention to the effe cts of
noise fr om signal s with wiring runn ing
para llel to these l ines in this re gion.
PLL_
VDD
PLL_
C1
GND

Figure 4.2 Schematic View from Below the Board

Caution. PLL_VDD and PLL_GND lines should be as short and thick as possible in PCB wiring.
Longer wiring leads to stronger crosstalk because the LC components of the wiring
increase, more readily leading to effects.
R18UZ0021EJ0400
Dec. 28, 2018
C2
4. PLL Power Pins
Power supply
FB
FB
GND
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