Renesas R-IN32M3 Series User Manual page 8

22.5 How to Get BSDL ............................................................................................................................................ 51
22.6 Notes on Using BSDL <R> .............................................................................................................................. 51
23. IBIS Information ........................................................................................................................................... 52
24. Marking Information ..................................................................................................................................... 53
24.1 R-IN32M3-EC .................................................................................................................................................. 53
24.2 R-IN32M3-CL .................................................................................................................................................. 53
25. Thermal Design <R> ................................................................................................................................... 54
25.1 Deciding on whether Particular Measures for Heat Dissipation are Required .................................................. 54
25.1.1 Estimating Tj ........................................................................................................................................... 54
25.1.2 Estimating Power Consumption .............................................................................................................. 54
Thermal Resistances under the JEDEC Conditions (for θja and Ψjt) ...................................................... 55
25.1.3
25.1.4 Results of Estimating Power Consumption of the 1-V Sub-Systems at Tj .............................................. 55
Relation between Temperature Increases (∆t) and Thermal Resistance (θja) at a Given Ambient
25.1.5
Temperature ............................................................................................................................................. 57
25.2 Examples of Measures for Heat Dissipation ..................................................................................................... 58
25.2.1 Measures for Heat Release in Designing the Board ................................................................................. 59
25.2.2 Heat Dissipation from the Periphery (Including the Casing) ................................................................... 61
25.3 Points for Caution ............................................................................................................................................. 62
25.3.1 Internal Regulator .................................................................................................................................... 62
25.3.2 Handling of Unused Pins ......................................................................................................................... 62
26. Countermeasure for Noise <R> .................................................................................................................. 64
26.1 Stopping Clock Output ..................................................................................................................................... 64
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