Figure 36. Ufqfpn48 - 7 Mm X 7 Mm, 0.5 Mm Pitch, Package Outline - STMicroelectronics STM32F042G4 Manual

Arm-based 32-bit mcu, up to 32 kb flash, crystal-less usb fs 2.0, can, 8 timers, adc & comm. interfaces, 2.0 - 3.6 v

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Package characteristics

1. Drawing is not to scale.

2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.

3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and

solder this back-side pad to PCB ground.

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Figure 36. UFQFPN48 – 7 mm x 7 mm, 0.5 mm pitch, package outline

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STM32F042xx

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