Table 69. Ufqfpn32 - 5 X 5 Mm, 32-Lead Ultra Thin Fine Pitch Quad Flat No-Lead Package; Figure 44. Ufqfpn32 - 5 X 5 Mm, 32-Lead Ultra Thin Fine Pitch Quad Flat No-Lead Package Outline; Mechanical Data - STMicroelectronics STM32F042G4 Manual

STM32F042xx

Figure 44. UFQFPN32 - 5 x 5 mm, 32-lead ultra thin fine pitch quad flat no-lead package outline

1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device ground and must
be connected. It is referred to as pin 0 in
Table 69. UFQFPN32 – 5 x 5 mm, 32-lead ultra thin fine pitch quad flat no-lead package
Dim.
Min
A 0.5
A1 0.00
A3 -
b 0.18
D 4.90
D2 -
E 4.90
E2 3.40
e -
L 0.30
ddd
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Seating plane
C
A3
e
9
8
b
E2
1
32
Pin # 1 ID
R = 0.30
Bottom view
Table 12: Legend/abbreviations used in the pinout

mechanical data

millimeters
Typ
0.55
0.02
0.152
0.23
5.00
3.50
5.00
3.50
0.500
0.40
0.08
DocID025832 Rev 2
A1
D
16
17
E
24
L
D2
L
Max Min
0.6 0.0197
0.05 0
- -
0.28 0.0071
5.10 0.1929
- -
5.10 0.1929
3.60 0.1339
- -
0.50 0.0118
Package characteristics
ddd C
A
A0B8_ME
table.
(1)
inches
Typ
0.0217
0.0008
0.006
0.0091
0.1969
0.1378
0.1969
0.1378
0.0197
0.0157
0.0031
Max
0.0236
0.0020
-
0.0110
0.2008
-
0.2008
0.1417
-
0.0197
107/117
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