Table 71. Tssop20 - 20-Pin Thin Shrink Small Outline Package Mechanical Data; Figure 50. Tssop20 - 20-Pin Thin Shrink Small Outline - STMicroelectronics STM32F042G4 Manual

Package characteristics
1. Drawing is not to scale.
Table 71. TSSOP20 – 20-pin thin shrink small outline package mechanical data
Symbol
Min
A
A1 0.05
A2 0.8
b 0.19
c 0.09
(2)
D 6.4
E 6.2
(3)
E1 4.3
e
L 0.45
L1
k 0.0°
aaa
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per side.
3. Dimension "E1" does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per
side.
112/117

Figure 50. TSSOP20 - 20-pin thin shrink small outline

millimeters
Typ
-
-
1
6.5
6.4
4.4
- 0.65
0.6
- 1
-
- -
DocID025832 Rev 2
Max Min
1.2 -
0.15 0.002
1.05 0.0315
0.3 0.0075
0.2 0.0035
6.6 0.252
6.6 0.2441
4.5 0.1693
- -
0.75 0.0177
- -
8.0° 0.0°
0.1 -
STM32F042xx
(1)
inches
Typ
- 0.0472
- 0.0059
0.0394 0.0413
- 0.0118
- 0.0079
0.2559 0.2598
0.252 0.2598
0.1732 0.1772
0.0256 -
0.0236 0.0295
0.0394 -
- 8.0°
- 0.0039