Table 70. Ufqfpn28 - 4 X 4 Mm, 28-Lead Ultra Thin Fine Pitch Quad Flat No-Lead Package; Figure 47. Ufqfpn28 - 4 X 4 Mm, 28-Lead Ultra Thin Fine Pitch Quad Flat No-Lead Package Outline; Mechanical Data - STMicroelectronics STM32F042G4 Manual

STM32F042xx

Figure 47. UFQFPN28 - 4 x 4 mm, 28-lead ultra thin fine pitch quad flat no-lead package outline

1. Drawing is not to scale.
2. Dimensions are in millimeters.
3. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
Table 70. UFQFPN28 – 4 x 4 mm, 28-lead ultra thin fine pitch quad flat no-lead package X
Symbol
Min
A 0.5
A1 -0.05
D 3.9
D1 2.9
E 3.9
E1 2.9
L 0.3
L1 0.25
T
b 0.2
e
1. Values in inches are converted from mm and rounded to 4 decimal digits.
millimeters
Typ
0.55
0
4
3
4
3
0.4
0.35
- 0.152
0.25
- 0.5
DocID025832 Rev 2

mechanical data

Max
0.6 0.0197
0.05 -0.002
4.1 0.1535
3.1 0.1142
4.1 0.1535
3.1 0.1142
0.5 0.0118
0.45 0.0098
-
0.3 0.0079
-
Package characteristics
(1)
inches
Min Typ
0.0217
0
0.1575
0.1181
0.1575
0.1181
0.0157
0.0138
- 0.006
0.0098
- 0.0197
Max
0.0236
0.002
0.1614
0.122
0.1614
0.122
0.0197
0.0177
-
0.0118
-
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