Brm Module - Samsung OFFICESERV 7100 Service Manual

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6.7 2BRM Module

Level Part Code
..1 0403-001407
..1 0801-002894
..1 1205-002283
..1 1401-001087
..1 1401-001087
..1 2007-000043
..1 2007-000045
..1 2007-000052
..1 2007-000052
..1 2007-000060
..1 2007-000070
..1 2007-000287
..1 2007-000287
..1 2007-000475
..1 2007-002899
© SAMSUNG Electronics Co., Ltd.
Location
ZD111~ZD114, ZD121~ZD124,
ZD211~ZD214, ZD221~ZD224
U4
U1, U2
V111
V112, V113, V121~V123,
V211~V213, V221~V223
R182, R184
R131~R133, R231~R233
R145, R146, R185
R187, R245, R246
R177, R178,
R121, R123, R191, R193, R195,
R221, R223, R292, R293, R294
R101, R102, R135, R136, R201,
R202, R235
R236
R179, R180
R122, R124, R222, R224
Product Name
DIODE-ZENER MMSZ5242B, 11.4-12.6 V, 500 MW, SOD-123, TP
IC-CMOS LOGIC 74LVC126, BUS BUFFER GATE, TSSOP, 14P, 5.0x4.4 mm,
QUAD, TR, -, -, -, -, -40to+85C, -, 1.7 V, -,
IC-SAC PEB3086H, MQFP, 64P, 14X14 MM, PLASTIC, 3.3 V, -, 0TO+70C,
TR, ISAC-SX TRANSCEIVER
THYRISTOR-SIDAC P0640SCLRP, 58 V, -, 500A , DO-214AA, TP
THYRISTOR-SIDAC P0640SCLRP, 58 V, -, 500 A, DO-214 AA, TP
R-CHIP 1 Kohm, 1%, 1/10 W, TP, 1608
R-CHIP 3.32 Kohm, 1%, 1/10 W, TP, 1608
R-CHIP 10 Kohm, 1%, 1/10 W, TP, 1608
R-CHIP 10 Kohm, 1%, 1/10 W, TP, 1608
R-CHIP 100 Kohm, 1%, 1/10 W, TP, 1608
R-CHIP 0 ohm, 5%, 1/10 W, TP, 1608
R-CHIP 100 ohm, 1%, 1/10 W, TP, 1608
R-CHIP 100 ohm, 1%, 1/10 W, TP, 1608
R-CHIP 1 Mohm, 1%, 1/10 W, TP, 1608
R-CHIP 10 ohm, 1%, 1/10 W, TP, 1608
Description
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