DEC 4000 AXP Service Manual page 237

Magnetic tape
preparing for UETP, 3–27, 3–29
Maintenance log, 1–12
Maintenance strategy, 1–1, 1–8
field feedback, 1–12
information services, 1–11
service delivery, 1–7
service tools and utilities, 1–8
Mass storage
configuration rules, 6–20
described, 6–19
fixed-media, described, 6–19
removable-media, described, 6–21
memexer command, 3–10
memexer_mp command, 3–11
Memory module
displaying information for, 6–29
MS430, 6–11
removal and replacement, 5–16
Memory modules
MS430, 6–10
Memory, main
exercising, 3–10
Microprocessor chip
See DECchip 21064 microprocessor
Modules
CPU features, 6–8
KFA40 I/O, 6–13
KN430 CPU, 6–7
MS430 variations, 6–10
MS430 memory modules, 6–10
Multiprocessor bootstrap, 2–37
N
Network, testing, 3–20
NODENAME parameter, 6–37
nvram file, 2–26
O
OLDUETP.LOG file, 3–33
Open VMS AXP
event record translation, 4–6
Operating system
boot failures, reporting, 1–3, 1–7
crash dumps, 1–10
exercisers, 1–10
Operator control panel
removal and replacement, 5–4
Operator control panel LEDs, 2–7 to 2–9
Options
See the DEC 4000 Options Guide
Overtemperature, 2–2
P
PARAMS local program, 3–23
Power
diagnostic flow, 1–4
troubleshooting, 1–2
Power control bus, 6–23
Power problems
diagnostic flow, 1–4
PSC failure, 2–2
troubleshooting, 1–2
Power subsystem components, 6–17
Power supply
LEDs, 2–2
removal and replacement, 5–17
Power-on tests, 2–27
Power-up, 2–27
option LEDs, 1–10
Power-up screens, 2–15
Power-up sequence, 2–27
AC, 2–27
DC, 2–29
mass storage failures, 2–18
robust mode, 2–26
Product delivery plan, 1–11
Programs, local
DIRECT, 3–23
DKUTIL, 3–23
Index–5