Toshiba Satellite Pro M10 Series Maintenance Manual page 330

4 Replacement Procedures
9. Assembly of Tape shield and Tape Adhesive used for Top case fixing. Pressure or
stress should not be given on Top case during this process
10. Assembly of Cover shield (C). Pressure or stress should not be given on control PCB.
Usage of gloves with anti-electric discharge coating is recommended. To eliminate
possible damage on circuits occurred by ESC.
11. Assembly of Cover shield (G). Pressure or stress should not be given on Gate TCP.
12. Assembly of Tape adhesive used for B/L Wire fixing. Pressure or stress should not be
given on B/L Wire.
Figure 4-89 Assembly of outside Tape and Cover shield
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4.30 TFT FL (Model 15.0 XGA LG. Philips LP150X06 A2)
Satellite Pro M10 Series Maintenance Manual (960-431)