Pin Configuration; Ml63611 Pin Configuration - Oki ML63611 User Manual

ML63611 User's Manual
Chapter 1 Overview
1.6

Pin Configuration

1.6.1 ML63611 Pin Configuration

The ML63611 chip pin configuration and pad coordinates are shown in Figures 1-5 and Table 1-2 respectively.
L3 96
L2 97
L1 98
L0 99
TRIMB5 100
TRIMB4 101
TRIMB3 102
TRIMDB1 103
TRIMB2 104
TRIMB1 105
TRIMB0 106
TRIMDB2 107
TRIM3 108
TRIM2 109
TRIMD 110
TRIM1 111
TRIM0 112
V 113
DD1
V 114
DD2
V 115
DD3
C1 116
C2 117
V 118
CH
V 119
XT
V 120
HF
HC1 121
HC2 122
V 123
SS
OSC1 124
OSC0 125
RESET 126
XT1 127
XT0 128
V 129
DD
Chip Size
Chip Thickness
Coordinate Origin
Pad Hole Size
Pad Size
Minimum Pad Pitch
Number of bonding pads
Notes: The chip substrate voltage is V
OPTION A (C): 1.5 V (3.0 V), Without regulator
circuit for LCD bias
: 5.20 mm × 5.20 mm
: 350 µm (typ.) (280 µm: available as required)
: Chip center
: 80 µm × 80 µm
: 90 µm × 90 µm
: 115 µm
: 116 (total number of pads: 129)
Do not bond pins 100 to 112 (marked by " "). Leave them open.
Figure 1-5 ML63611 Chip Pin Configuration (Top View)
Y
X
( 0.0 )
.
SS
1 – 12
OPTION B (D): 1.5 V (3.0 V), With regulator
65 L34
64
L35
63 V
62 PE.3
61 PE.2
60 PE.1
59 PE.0
58 PC.3
57 PC.2
56 PC.1
55 PC.0
54 PB.3
53 PB.2
52 PB.1
51 PB.0
50 PA.3
49 PA.2
48 PA.1
47 PA.0
46 P0.3
45 P0.2
44 P0.1
43 P0.0
42 MDB
41 MD
40 TST2
39 TST1
ML63611
V
38
37 RT1
36 RS1
35 CS1
34 IN1
33 IN0
circuit for LCD bias
SS
DD