Introduction To High Bandwidth Memory; Hbm2 In Intel Stratix 10 Mx Devices - Intel Stratix 10 MX HBM2 IP User Manual

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UG-20031 | December 2017

1 Introduction to High Bandwidth Memory

High Bandwidth Memory (HBM) is a JEDEC specification (JESD-235) for a wide, high
bandwidth memory device. The next generation of High Bandwidth Memory, HBM2, is
defined in JEDEC specification JESD-235A. The HBM2 implementation in Intel
®
Stratix
The High Bandwidth Memory DRAM is tightly coupled to the host die with a distributed
interface. The interface is divided into independent channels, each completely
independent of one another. Each channel interface maintains a 128-bit data bus,
operating at DDR data rates.

1.1 HBM2 in Intel Stratix 10 MX Devices

Intel Stratix 10 MX incorporates a high-performance FPGA fabric along with a HBM2
DRAM in a single package. Intel Stratix 10 MX devices support up to a maximum of
two HBM2 interfaces.
Intel Stratix 10 MX incorporates Intel's Embedded Multi-Die Interconnect Bridge
(EMIB) technology to implement a silicon bridge between HBM2 DRAM memory and
the Universal Interface Block Subsystem (UIBSS), which contains the HBM2 controller
(HBMC), physical-layer interface (PHY), and I/O ports to interface to the HBM2 stack.
As illustrated below, each Intel Stratix 10 MX device contains a single universal
interface bus per HBM2 interface, supporting 8 independent channels.
The user interface to the HBM2 controller is maintained through the AIX4 protocol.
Sixteen AXI interfaces are available in the user interface from each HBM2 controller,
with one AXI interface available per HBM2 Pseudo Channel. HBM2 DRAM density of
4GB and 8GB are supported.
Figure 1.
Intel Stratix 10 MX Device with UIB, EMIB, and HBM2 DRAM
Intel Corporation. All rights reserved. Intel, the Intel logo, Altera, Arria, Cyclone, Enpirion, MAX, Nios, Quartus
and Stratix words and logos are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other
countries. Intel warrants performance of its FPGA and semiconductor products to current specifications in
accordance with Intel's standard warranty, but reserves the right to make changes to any products and services
at any time without notice. Intel assumes no responsibility or liability arising out of the application or use of any
information, product, or service described herein except as expressly agreed to in writing by Intel. Intel
customers are advised to obtain the latest version of device specifications before relying on any published
information and before placing orders for products or services.
*Other names and brands may be claimed as the property of others.
10 MX devices complies to JESD-235A.
®
ISO
9001:2008
Registered

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