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Intel 848P manual available for free PDF download: Thermal Design Manual
Intel 848P Thermal Design Manual (35 pages)
Chipset for the Intel 82848P Memory Controller Hub (MCH)
Brand:
Intel
| Category:
Controller
| Size: 1.39 MB
Table of Contents
Table of Contents
3
1 Introduction
7
Terminology
7
Reference Documents
8
2 Product Specifications
9
Package Description
9
Non-Grid Array Package Ball Placement
9
Figure 1. MCH Non-Grid Array
9
Thermal Specifications
10
Thermal Design Power (TDP)
10
Table 1. Intel ® 82848P MCH Case Temperature Specifications
10
Application Power
11
Methodology
11
Specifications
11
Mechanical Specifications
11
Table 2. Intel ® 82848P MCH Thermal Design Power Specifications
11
Table 3. MCH Mechanical Specifications
11
3 Thermal Metrology
13
Case Temperature Measurements
13
Thermocouple Attach Methodology
13
Figure 2. Zero-Degree Angle Attach Methodology
14
Figure 3. Zero-Degree Angle Attach Heatsink Modifications
14
Thermal Mechanical Test Vehicle
15
TMTV Daisy Chain Operation
15
Figure 4. TMTV Daisy Chain Structure
16
TMTV Thermal Operation
17
Figure 5. Example Complementary Test Board Connections
17
Figure 6. TMTV die Heater Representation
17
Table 4. TMTV Heater Connections
17
Recommended Test Parameters
18
Table 5. TMTV Correction Factor
18
TMTV Correction Factors
18
Airflow Characterization
19
Figure 7. Airflow Temperature Measurement Locations
19
4 Reference Thermal Solution
21
Operating Environment
21
Figure 8. Processor Heatsink Orientation to Provide Airflow to MCH Heatsink
21
Mechanical Design Envelope
22
Thermal Solution Assembly
22
Figure 9. Wave Solder Heatsink Installed on Board
22
Alternate WSHS for Non-Rotated MCH
23
Manufacturing with the WSHS
23
Assembly Process Settings
23
Inspection Criteria
23
Table 6. Wave Solder Recommended Settings for WSHS
23
WSHS Removal and Installation Procedure
24
Removal Via Lead Clipping Methodology
24
Figure 10. 55-Degree Angle Clippers
24
Figure 11. WSHS Lead Clipping Order
25
Removal Via De-Soldering Methodology
26
Figure 12. Example Vertical Rework Jig
26
Re-Installation Methodology
27
Figure 13. WSHS Target
27
Environmental Reliability Requirements
28
Table 7. Reference Thermal Solution Environmental Reliability Requirements
28
Appendix A: Enabled Suppliers
29
Table 8. MCH Wave Solder Heatsink Enabled Suppliers
29
Appendix B: Mechanical Drawings
31
Figure 14. MCH Package Drawing
32
Figure 15. MCH Component Keep-Out Restrictions
33
Figure 16. WSHS Heatsink Extrusion Drawing
34
Figure 17. WSHS Heatsink Assembly Drawing
35
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