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Orderable Device
Status
(1)
TMS320C6670XCYPA
ACTIVE
TMS320C6670XCYPA2
ACTIVE
TMX320C6670AXCYP
OBSOLETE
TMX320C6670CYP
OBSOLETE
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Package Type Package
Pins Package
Drawing
Qty
FCBGA
CYP
841
FCBGA
CYP
841
FCBGA
CYP
841
FCBGA
CYP
841
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
Green (RoHS
SNAGCU
Level-4-245C-72HR
& no Sb/Br)
Green (RoHS
SNAGCU
Level-4-245C-72HR
& no Sb/Br)
TBD
Call TI
TBD
Call TI
Addendum-Page 2
PACKAGE OPTION ADDENDUM
Op Temp (°C)
(3)
-40 to 100
TMS320C6670XCYP
@2010 TI
A1GHZ
-40 to 100
TMS320C6670XCYP
@2010 TI
A1.2GHZ
Call TI
0 to 85
Call TI
0 to 85
http://www.ti.com/productcontent
for the latest availability
4-Nov-2016
Device Marking
Samples
(4/5)
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