Glossary - Intel SE7520JR2 Technical Manual

Glossary

This appendix contains important terms used in the preceding chapters. For ease of use,
numeric entries are listed first (e.g., "82460GX") with alpha entries following (e.g., "AGP 4x").
Acronyms are then entered in their respective place, with non-acronyms following.
Term
ACPI Advanced Configuration and Power Interface
AP Application Processor
APIC Advanced Programmable Interrupt Control
ASIC application specific integrated circuit
BIOS Basic input/output system
BIST Built-in self test
BMC Sahalee Baseboard Management Controller
Bridge Circuitry connecting one computer bus to another, allowing an agent on one to access the other.
BSEL
BSP Bootstrap processor
byte 8-bit quantity.
CBC Chassis bridge controller. A microcontroller connected to one or more other CBCs. Together they
bridge the IPMB buses of multiple chassis.
CEK Common Enabling Kit
CHAP Challenge Handshake Authentication Protocol
CMOS In terms of this specification, this describes the PC-AT compatible region of battery-backed 128 bytes
of memory, which normally resides on the baseboard.
DPC Direct Platform Control
EEPROM Electrically erasable programmable read-only memory
EHCI Enhanced Host Controller Interface
EMP Emergency management port.
EPS External Product Specification
FMB Flexible Mother Board
FMC Flex Management Connector
FMM Flex Management Module
FRB Fault resilient booting
FRU Field replaceable unit
FSB Front side Bus
GB 1024 MB.
GPIO General purpose I/O
GTL Gunning Transistor Logic
HSC Hot-swap controller
Hz Hertz (1 cycle/second)
I2C Inter-integrated circuit bus
IA Intel® architecture
IBF Input buffer
ICH I/O controller hub
ICMB Intelligent Chassis Management Bus
IERR Internal error
222
Glossary
Definition
C78844-002
Intel® Server Board SE7520JR2
Revision 1.0