Thermal Specifications; Package Thermal Specifications - Intel E5205 - Cpu Xeon 1.86Ghz Fsb1066Mhz 6M Lga771 Dual Core Tray Datasheet

Thermal Specifications

6
Thermal Specifications
6.1

Package Thermal Specifications

The Dual-Core Intel® Xeon® Processor 5200 Series requires a thermal solution to
maintain temperatures within its operating limits. Any attempt to operate the processor
outside these operating limits may result in permanent damage to the processor and
potentially other components within the system. As processor technology changes,
thermal management becomes increasingly crucial when building computer systems.
Maintaining the proper thermal environment is key to reliable, long-term system
operation.
A complete solution includes both component and system level thermal management
features. Component level thermal solutions can include active or passive heatsinks
attached to the processor integrated heat spreader (IHS). Typical system level thermal
solutions may consist of system fans combined with ducting and venting.
This section provides data necessary for developing a complete thermal solution. For
more information on designing a component level thermal solution, refer to the Dual-
Core Intel® Xeon® Processor 5200 Series Thermal/Mechanical Design Guidelines
(TMDG).
Note: The boxed processor will ship with a component thermal solution. Refer to
for details on the boxed processor.
6.1.1 Thermal Specifications
To allow the optimal operation and long-term reliability of Intel processor-based
systems, the processor must remain within the minimum and maximum case
temperature (TCASE) specifications as defined by the applicable thermal profile (see
Table 6-1
Table 6-3
Table 6-6
Table 6-8, and
solutions not designed to provide this level of thermal capability may affect the long-
term reliability of the processor and system. For more details on thermal solution
design, please refer to the Dual-Core Intel® Xeon® Processor 5200 Series
Thermal/Mechanical Design Guidelines (TMDG).
The Dual-Core Intel® Xeon® Processor 5200 Series implements a methodology for
managing processor temperatures which is intended to support acoustic noise
reduction through fan speed control and to assure processor reliability. Selection of the
appropriate fan speed is based on the relative temperature data reported by the
processor's Platform Environment Control Interface (PECI) bus as described in
Section 6.3. If the value reported via PECI is less than T
temperature is permitted to exceed the Thermal Profile. If the value reported via PECI
is greater than or equal to T
at or below the temperature as specified by the thermal profile. The temperature
reported over PECI is always a negative value and represents a delta below the onset of
thermal control circuit (TCC) activation, as indicated by PROCHOT# (see
Processor Thermal Features). Systems that implement fan speed control must be
designed to use this data. Systems that do not alter the fan speed only need to
guarantee the case temperature meets the thermal profile specifications.
and Figure 6-1 for the Dual-Core Intel® Xeon® Processor E5200 Series,
and Figure 6-2 for the Dual-Core Intel® Xeon® Processor X5200 Series,
and Figure 6-3 for the Dual-Core Intel® Xeon® Processor L5200 Series, and
Figure 6-4 for the Dual-Core Intel® Xeon® Processor L5238. Thermal
CONTROL
CONTROL
, then the processor case temperature must remain
Chapter 8
, then the case
Section 6.2,
75