Boxed Processor Contents - Intel E5205 - Cpu Xeon 1.86Ghz Fsb1066Mhz 6M Lga771 Dual Core Tray Datasheet

Boxed Processor Specifications
around the heatsink. It is assumed that a 40°C T
chassis design to limit the T
of 35°C. These specifications apply to both copper and aluminum heatsink solutions.
Following these guidelines allows the designer to meet Dual-Core Intel® Xeon®
Processor 5200 Series Thermal Profile and conform to the thermal requirements of the
processor.
8.3.2.2 1U Passive/3U+ Active Combination Heat Sink Solution (Pedestal
Active)
The active configuration of the combination solution is designed to help pedestal
chassis users to meet the thermal processor requirements without the use of chassis
ducting. It may be still be necessary to implement some form of chassis air guide or air
duct to meet the T
Also, while the active thermal solution design will mechanically fit into a 2U volumetric,
it may not provide adequate airflow. This is due to the requirement of additional space
at the top of the thermal solution to allow sufficient airflow into the heat sink fan. Use
of the active configuration in a 2U rackmount chassis is not recommended.
It is recommended that the ambient air temperature outside of the chassis be kept at
or below 35°C. The air passing directly over the processor thermal solution should not
be preheated by other system components. Meeting the processor's temperature
specification is the responsibility of the system integrator.
8.3.2.3 2U Passive Heat Sink Solution (2U+ Rack or Pedestal)
In the 2U+ passive configuration, it is assumed that a chassis duct will be implemented
to provide a minimum airflow of 27 cfm at 0.182 in. H
flow impedance. The duct should be carefully designed to minimize the airflow bypass
around the heatsink. These specifications apply to both copper and aluminum heatsink
solutions. The T
superior design techniques to keep T
temperature of 35°C.
8.4

Boxed Processor Contents

A direct chassis attach method must be used to avoid problems related to shock and
vibration. The board must not bend beyond specification in order to avoid damage. The
boxed processor contains the components necessary to solve both issues. The boxed
processor will include the following items:
• Dual-Core Intel® Xeon® Processor 5200 Series
• Unattached heat sink solution
• Four screws, four springs, and four heat sink standoffs (all captive to the heat sink)
• Foam air bypass pad and skirt (included with 1U passive/3U+ active solution)
• Thermal interface material (pre-applied on heat sink)
• Installation and warranty manual
• Intel Inside Logo
Other items listed in
shipped with either the chassis or boards. They are as follows:
• CEK Spring (supplied by baseboard vendors)
• Chassis standoffs (supplied by chassis vendors)
at or below 5°C with an external ambient temperature
RISE
temperature of 40
LA
°
temperature of 40 C should be met. This may require the use of
LA
RISE
Figure 8-3 that are required to complete this solution will be
is met. This requires a superior
LA
°
C depending on the pedestal chassis layout.
O (45.9 m
2
at or below 5°C based on an ambient external
3
/hr at 45.3 Pa) of
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