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1
PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note:
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using
insulators that easily build static electricity. Semiconductor devices must be stored and transported
in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work bench and floor should be grounded. The operator should be grounded using
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions
need to be taken for PW boards with semiconductor devices on it.
2
HANDLING OF UNUSED INPUT PINS FOR CMOS
Note:
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided
to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input
levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each
unused pin should be connected to V
possibility of being an output pin. All handling related to the unused pins must be judged device
by device and related specifications governing the devices.
3
STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note:
Power-on does not necessarily define initial status of MOS device. Production process of MOS
does not define the initial operation status of the device. Immediately after the power source is
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does
not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until
the reset signal is received. Reset operation must be executed immediately after power-on for
devices having reset function.
EEPROM and IEBus are trademarks of NEC Corporation.
Windows is either a registered trademark or trademark of Microsoft Corporation in the United States and/
or other countries.
PC/AT is a trademark of International Business Machines Corporation.
SPARCstation is a trademark of SPARC International, Inc.
Solaris and SunOS are trademarks of Sun Microsystems, Inc.
HP9000 series 700 and HP-UX are trademarks of Hewlett-Packard Company.
NEWS and NEWS-OS are trademarks of Sony Corporation.
Ethernet is a trademark of Xerox Corporation.
OSF/Motif is a trademark of the Open Software Founction, Inc.
TRON is the abbreviation for the Realtime Operating system Nucleus.
ITRON is the abbreviation for Industrial TRON.
NOTES FOR CMOS DEVICES
or GND with a resistor, if it is considered to have a
DD
User's Manual U12697EJ3V0UM
3
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