Figure 9: Sed1352D0B Pad Diagram - Epson SED1352 Technical Manual

Epson Research and Development
Vancouver Design Center
LP
WF
XSCL
LCDENB
VOE#
IOCS#
IOW#
IOR#
MEMCS#
MEMW#
MEMR#
READY
BHE#
OSC1
OSC2
DB0
DB1
DB2
DB3
DB4
DB5
DB6
DB7
V
SS
V
DD
Dummy Pad
Chip Size
Chip Thickness
Pad Size
Pad Patch
Hardware Functional Specification
Issue Date: 99/07/28
70
80
90
100
1 10
=
4.00 mm x 4.00 mm
= 0.400 mm
=
0.090 mm x 90 mm
= 0.140 mm (Min.)

Figure 9: SED1352D0B Pad Diagram

60
20
Page 19
Dummy Pad
50 V
DD
V
SS
VD7
VD6
VD5
VD4
VD3
VD2
VD1
VD0
40
VA10
VA9
VA8
VA7
VA6
VA5
VA4
VA3
VA2
VA1
VA0
30
RESET
AB19
AB18
AB17
SED1352
X16-SP-001-16