Chipset; I2C Serial Interface And Device - SMART Embedded Computing COMX-CORE-2610-ET Installation And Use Manual

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Support Digital Thermal Sensor, Intel Adaptive Thermal Monitor
Manufactured on 32nm process
TDP include 17W, 25W, 35W and 45W
Package: A 31 x 24mm BGA package (BGA1023)
4.4

Chipset

The COMX-CORE-2610-ET supports Intel Mobile QM67 chipset. The features of the
chipset are:
Supports up to eight x1 PCI Express interfaces
Supports up to two SATA 6G and four SATA 3G
Supports up to 14 USB 2.0
Provides a LPC interface for TPM, FWH etc.
Provides a SM bus, it is I2C compatible
Provides two chip select of SPI
SPI frequency is 20MHz or 33MHz
Provides a HD audio interface
Supports VGA + LVDS display interface
Supports three digital display interfaces
4.5

I2C Serial Interface and Device

There is an SM bus controller on QM67 PCH, which is I2C compatible. Following are the
devices that connect to SM bus.
2KB serial EEPROM for vendor information
The SPD of two DDR3 SODIMM
Embedded controller NCT7802Y
LAN Intel82579LM
I2C interface routing to connector for devices on carrier board through PCA9515
COMX-CORE-2610-ET Installation and Use (6806800P11E)
Chipset
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