Board Thermal Management And Placement; Board Thermal Management; Figure 2-1 Board Thermal Management - SMART Embedded Computing COMX-CORE-2610-ET Installation And Use Manual

Board Thermal Management and Placement

Table 2-2
memory) (continued)
State
Idle (Windows 7)
Full Loading (TAT+ 3DMark)
2.2 Board Thermal Management and Placement
2.2.1

Board Thermal Management

The COMX-CORE-2610-ET provides several thermal management strategies that
includes monitoring CPU junction temperature and board PCB temperature. The board can
take corresponding action to protect the system from catastrophic overheating.
Figure 2-1
A thermal transistor is embedded in the processor. The EC chip NCT7802Y can read the
thermal sensor temperature through PECI signal. System can get the temperature data
through SMBus from EC chip.
34
Module with CORE i7 2610UE Power Requirement (with 2x2 GB non-ECC
+12V
1.09A
2.34A
Board Thermal Management
COMX-CORE-2610-ET Installation and Use (6806800P11E)
Hardware Preparation and Installation
5VSB VCC_RTC
0.041A 0
0.068A 0
Total power
consumption
13.28W
28.42W