Digi XBee3-PRO Hardware Reference Manual
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Digi XBee3-PRO Hardware Reference Manual

Rf module
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XBee3™
RF Module
Hardware Reference Manual

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Summary of Contents for Digi XBee3-PRO

  • Page 1 XBee3™ RF Module Hardware Reference Manual...
  • Page 2 Information in this document is subject to change without notice and does not represent a commitment on the part of Digi International. Digi provides this document “as is,” without warranty of any kind, expressed or implied, including, but not limited to, the implied warranties of fitness or merchantability for a particular purpose.

  • Page 3: Table Of Contents

    Contents XBee3™ RF Module Hardware Reference Manual General XBee3 specifications General specifications Regulatory conformity summary Serial communication specifications UART pin assignments GPIO specifications 802.15.4-specific specifications Performance specifications Power requirements Networking and security specifications Communication interface specifications Hardware Mechanical drawings XBee3 surface-mount (U.FL/RF Pad) XBee3 surface-mount (embedded antenna) XBee3 micro (U.FL/RF Pad) XBee3 micro (chip antenna)
  • Page 4 FCC-approved antennas (2.4 GHz) RF exposure Europe (CE) Maximum power and frequency specifications OEM labeling requirements Declarations of conformity Antennas IC (Industry Canada) Labeling requirements For XBee3: RF Exposure Manufacturing information Recommended solder reflow cycle Handling and storage Recommended footprint Flux and cleaning Reworking XBee3™...

  • Page 5: Xbee3™ Rf Module Hardware Reference Manual

    XBee3™ RF Module Hardware Reference Manual This manual provides information for the XBee3 RF Module hardware. The XBee3 RF Module can be either the micro or the surface-mount form factor. For more information about the operation and programming functions of the device, see the XBee3®...

  • Page 6: General Xbee3 Specifications

    General XBee3 specifications The following tables provide general specifications for the hardware. General specifications Regulatory conformity summary Serial communication specifications GPIO specifications XBee3™ RF Module Hardware Reference Manual...

  • Page 7: General Specifications

    General XBee3 specifications General specifications General specifications The following table describes the general specifications for the devices. XBee3/XBee3-PRO Micro Specification XBee3/XBee3-PRO surface-mount Operating frequency ISM 2.4 - 2.5 GHz band Form factor Micro Surface-mount Micro: 1.36 cm x 1.93 cm x 0.241 cm Surface-mount: 2.199 x 3.4 x 0.368...

  • Page 8: Serial Communication Specifications

    General XBee3 specifications Serial communication specifications Serial communication specifications The XBee3 RF Module supports Universal Asynchronous Receiver / Transmitter (UART). UART pin assignments Specifications Device pin number UART pins XBee3 Micro XBee3 Surface-mount DOUT/DIO13 DIN / CONFIG/DIO14 CTS / DIO7 RTS/ DIO6 GPIO specifications XBee3 RF Modules have 15 General Purpose Input / Output (GPIO) ports available.

  • Page 9: 802.15.4-Specific Specifications

    802.15.4-specific specifications The following tables provide specifications specific to the XBee3 RF Module when using the 802.15.4 physical layer, for example: Zigbee, DigiMesh, and so forth. Performance specifications Power requirements Networking and security specifications Communication interface specifications XBee3™ RF Module Hardware Reference Manual...

  • Page 10: Performance Specifications

    Performance specifications Performance specifications The following table describes the performance specifications for the devices. XBee3 Specification XBee3-PRO Indoor/urban range Up to 60 m (200 ft) Up to 90 m (300 ft) Outdoor RF line-of-sight range Up to 1200 m (4000 ft)

  • Page 11: Hardware

    Hardware Mechanical drawings Pin signals for the XBee3 surface-mount module Pin signals for the XBee3 micro module Design notes XBee3™ RF Module Hardware Reference Manual...

  • Page 12: Mechanical Drawings

    Hardware Mechanical drawings Mechanical drawings The following mechanical drawings of the XBee3 RF Modules show all dimensions in inches. XBee3 surface-mount (U.FL/RF Pad) XBee3™ RF Module Hardware Reference Manual...

  • Page 13: Xbee3 Surface-Mount (Embedded Antenna)

    Hardware Mechanical drawings XBee3 surface-mount (embedded antenna) XBee3™ RF Module Hardware Reference Manual...

  • Page 14: Xbee3 Micro (U.fl/Rf Pad)

    Hardware Mechanical drawings XBee3 micro (U.FL/RF Pad) XBee3™ RF Module Hardware Reference Manual...

  • Page 15: Xbee3 Micro (Chip Antenna)

    Hardware Pin signals for the XBee3 surface-mount module XBee3 micro (chip antenna) Pin signals for the XBee3 surface-mount module The following drawing shows the surface-mount (SMT) pin locations. XBee3™ RF Module Hardware Reference Manual...
  • Page 16 Hardware Pin signals for the XBee3 surface-mount module The following table shows the pin signals and their descriptions for the surface-mount device. Default Pin# Name Direction state Description Ground. Power supply. DOUT /DIO13 Both Output UART data out /GPIO. DIN / CONFIG /DIO14 Both Input UART data in...
  • Page 17 Hardware Pin signals for the XBee3 surface-mount module Default Pin# Name Direction state Description DTR/SLEEP_RQ /DIO8 Both Input Pin sleep control Line/GPIO. Ground. Serial peripheral SPI_ATTN/ BOOTMODE/DIO19 Output Output interface attention . Do not tie low on reset. Ground. SPI_CLK /DIO18 Input Input Serial peripheral...

  • Page 18: Pin Signals For The Xbee3 Micro Module

    Hardware Pin signals for the XBee3 micro module Default Pin# Name Direction state Description Do not connect or connect to [reserved] Disabled Ground. ASSOCIATE/DIO5 Both Output Associate Indicator/GPIO. RTS/DIO6 Both Input Request to send flow control /GPIO. AD3/DIO3 Both Disabled Analog input/GPIO.
  • Page 19 Hardware Pin signals for the XBee3 micro module The following table shows the pin signals and their descriptions for the XBee3 Micro device. Default Pin# Name Direction state Description Ground. Power supply. DOUT /DIO13 Both Output UART data out /GPIO. DIN / CONFIG /DIO14 Both Input...
  • Page 20 Hardware Pin signals for the XBee3 micro module Default Pin# Name Direction state Description Serial peripheral SPI_ATTN/ BOOTMODE/DIO19 Output Output interface attention Do not tie low on reset. Ground. SPI_CLK /DIO18 Input Input Serial peripheral interface clock/GPIO. SPI_SSEL/DIO17 Input Input Serial peripheral interface not select/GPIO.

  • Page 21: Design Notes

    Hardware Design notes Default Pin# Name Direction state Description AD3/DIO3 Both Disabled Analog input/GPIO. AD2/DIO2 Both Disabled Analog input/GPIO. AD1/DIO1 Both Disabled Analog input/GPIO. AD0 /DIO0 Both Input Analog input / GPIO / Commissioning button. Ground. Both RF I/O for RF pad variant.

  • Page 22: Antenna Performance

    Hardware Design notes Antenna performance Antenna location is important for optimal performance. The following suggestions help you achieve optimal antenna performance. Point the antenna up vertically (upright). Antennas radiate and receive the best signal perpendicular to the direction they point, so a vertical antenna's omnidirectional radiation pattern is strongest across the horizon.
  • Page 23 Hardware Design notes The following drawings illustrate important recommendations when you are designing with PCB/chip antenna devices. For optimal performance, do not mount the device on the RF pad footprint described in the next section, because the footprint requires a ground plane within the PCB antenna keep out area.

  • Page 24: Design Notes For Rf Pad Devices

    Hardware Design notes XBee3 Micro keepout area Notes 1. We recommend non-metal enclosures. For metal enclosures, use an external antenna. 2. Keep metal chassis or mounting structures in the keepout area at least 2.54 cm (1 in) from the antenna. 3.
  • Page 25 Hardware Design notes Space any ground fill on the top layer at least twice the distance d, for Micro modules at least 0.028" and for surface mount modules at least 0.050". Additional considerations: The top two layers of the PCB have a controlled thickness dielectric material in between. The second layer has a ground plane which runs underneath the entire RF pad area.
  • Page 26 Hardware Design notes Number Description RF pad pin. 50 Ω microstrip trace. RF connection of RPSMA jack. This example is on a surface-mount device. The width in this example is approximately 0.045" for a 50 Ω trace, assuming d=0.025”, and that the dielectric has a relative permittivity of 4.4. This trace width is a good fit with the device footprint's 0.060"...

  • Page 27: Regulatory Information

    Regulatory information United States (FCC) Europe (CE) IC (Industry Canada) XBee3™ RF Module Hardware Reference Manual...

  • Page 28: United States (Fcc)

    FCC notices IMPORTANT: XBee3 RF Modules have been certified by the FCC for use with other products without any further certification (as per FCC section 2.1091). Modifications not expressly approved by Digi could void the user's authority to operate the equipment.

  • Page 29: Fcc-Approved Antennas (2.4 Ghz)

    The antennas in the tables below have been approved for use with this module. Cable loss is required when using gain antennas as shown in the tables. Digi does not carry all of these antenna variants. Contact Digi Sales for available antennas. XBee3™ RF Module Hardware Reference Manual...
  • Page 30 The following table shows the antennas approved for use with the XBee3 RF module. All antenna part numbers followed by an asterisk (*) are not available from Digi. Consult with an antenna manufacturer for an equivalent option. Required antenna cable loss (dB)
  • Page 31 Required antenna cable loss (dB) Type Gain 802.15.4 Based BLE (when (description) Part number (dBi) Application* Min. separation Protocols (Ex: ZigBee) available) A24-F9NF Omni-directional (Fiberglass base station) Fixed A24-F10NF Omni-directional (Fiberglass base station) 10.0 Fixed A24-F12NF Omni-directional (Fiberglass base station) 12.0 Fixed A24-W7NF Omni-directional (Fiberglass base station)
  • Page 32 Required antenna cable loss (dB) Type Gain 802.15.4 Based BLE (when (description) Part number (dBi) Application* Min. separation Protocols (Ex: ZigBee) available) A24-Y12NF Yagi (12-element) 12.0 Fixed A24-Y13NF Yagi (13-element) 12.0 Fixed A24-Y15NF Yagi (15-element) 12.5 Fixed A24-Y16NF Yagi (16-element) 13.5 Fixed A24-Y16RM Yagi (16-element, RPSMA connector)
  • Page 33 The following table shows the antennas approved for use with the XBee3-PRO RF Module. All antenna part numbers followed by an asterisk (*) are not available from Digi. Consult with an antenna manufacturer for an equivalent option. Required antenna cable loss (dB) Gain 802.15.4 Based Protocols...
  • Page 34 Required antenna cable loss (dB) Gain 802.15.4 Based Protocols BLE (when (dBi) Part number Type (description) Application* separation (Ex: ZigBee) available) A24-F9NF Omni-directional (Fiberglass base station) Fixed A24-F10NF Omni-directional (Fiberglass base station) Fixed A24-F12NF Omni-directional (Fiberglass base station) Fixed A24-W7NF Omni-directional (Fiberglass base station) Fixed A24-M7NF Omni-directional (Mag-mount base station)

  • Page 35: Rf Exposure

    Europe (CE) The XBee3 RF Module has been tested for use in several European countries. For a complete list, refer to www.digi.com/resources/certifications. If XBee3 RF Modules are incorporated into a product, the manufacturer must ensure compliance of the final product with articles 3.1a and 3.1b of the Radio Equipment Directive.

  • Page 36: Maximum Power And Frequency Specifications

    Maximum power and frequency specifications For the XBee3 device: When using 802.15.4 RF physical layer: Maximum power: 8.61mW (9.35 dBm) Equivalent Isotropically Radiated Power (EIRP). Frequencies: 5 MHz channel spacing, beginning at 2405 MHz and ending at 2480 MHz. When using BLE RF physical layer: Maximum power: 9.02mW (9.55 dBm) Equivalent Isotropically Radiated Power (EIRP).

  • Page 37: Declarations Of Conformity

    The CE marking must be affixed visibly, legibly, and indelibly. Digi customers assume full responsibility for learning and meeting the required guidelines for each country in their distribution market. Refer to the radio regulatory agency in the desired countries of operation for more information.

  • Page 38: Rf Exposure

    Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

  • Page 39: Manufacturing Information

    Manufacturing information Manufacturing information The XBee3 RF Module (both surface-mount and micro) is designed for surface-mounting on the OEM PCB. It has castellated pads to allow for easy solder attaching and inspection. The pads are all located on the edge of the device so there are no hidden solder joints on these devices. Recommended solder reflow cycle Handling and storage Recommended footprint...

  • Page 40: Recommended Solder Reflow Cycle

    Manufacturing information Recommended solder reflow cycle Recommended solder reflow cycle The following diagram shows the recommended solder reflow cycle. The device reflows during this cycle, and must not be reflowed upside down. Be careful not to jar the device while the solder is molten, as parts inside the device can be removed from their required locations.

  • Page 41: Recommended Footprint

    Manufacturing information Recommended footprint Recommended footprint We recommend that you use the following PCB footprints for surface-mounting. The dimensions without brackets are in inches, and those in brackets are in millimeters. XBee3 surface-mount recommended footprint XBee3™ RF Module Hardware Reference Manual...
  • Page 42 Manufacturing information Recommended footprint XBee3 Micro recommended footprint Match the solder footprint to the copper pads, but may need to be adjusted depending on the specific needs of assembly and product standards. Recommended stencil thickness is 0.15 mm/0.005”. Place the component last and set the placement speed to the slowest setting. While the underside of the device is mostly coated with solder resist, we recommended the copper layer directly below the device be left open to avoid unintended contacts.
  • Page 43 Manufacturing information Recommended footprint Copper keepout for the XBee3 surface-mount XBee3™ RF Module Hardware Reference Manual...

  • Page 44: Flux And Cleaning

    Copper keepout for the XBee3 Micro Flux and cleaning Digi recommends that a “no clean” solder paste be used in assembling these devices. This eliminates the clean step and ensures unwanted residual flux is not left under the device where it is difficult to remove.
  • Page 45 Manufacturing information Reworking solder melting point and care should be taken not to dislodge internal components from their intended positions. XBee3™ RF Module Hardware Reference Manual...

This manual is also suitable for:

Xbee3-pro microXbee3Xbee3-pro surface-mount

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