Reliability Test Data - Hitachi AP1 Data Book

RELIABILITY TEST DATA
1.
INTRODUCTION
Microcomputers provide high reliability and quality to meet
the demands of increased functions, enlarging scale, and wid-
ening application. Hitachi has improved the quality level of
microcomputer products by evaluating reliability, building
quality into the manufacturing process, strengthening inspection
techniques, and analyzing field data.
The following reliability and quality assurance data for
Hitachi 8-bit single-chip microcomputers indicates results from
test and failure analysis.
(1) Plastic DIP
Bonding wire
2.
PACKAGE AND CHIP STRUCTURE
2.1 Packaging
Production output and application of plastic packaging con-
tinues to increase, expanding to automobile measuring and con-
trol systems, and computer terminal equipment operating under
severe conditions. To meet this demand, Hitachi has significantly
improved moisture resistance and operational stability in the
plastic manufacturing process.
Plastic and side-brazed ceramic package structures are shown
in Figure I and Table I.
(2) Plastic Flat Package
Figure 1 Package Structure
Table 1 Package Material and Properties
Item Plastic DIP
Plastic Flat Package
Package
Epoxy Epoxy
Lead Solder dipping Alloy 42
Solder plating Alloy 42
Die bond Au·Si or Ag paste
Au·Si or Ag paste
Wire bond Thermo compression
Thermo compression
Wire Au
Au
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