Socket Standoffs And Package Seating Plane; Durability; Markings; Package And Board Enabling Mark (-2) - Intel Xeon E5-2400 Thermal/Mechanical Design Manual

LGA1356 Socket
Figure 2-7.

Package and Board Enabling Mark (-2)

2.4.1

Socket Standoffs and Package Seating Plane

Standoffs on the bottom of the socket base establish the minimum socket height after
solder reflow and are specified in
Similarly, a seating plane on the topside of the socket establishes the minimum
package height. See
2.5

Durability

The socket must withstand 30 cycles of processor insertion and removal. The max
chain contact resistance from
cycles.
The socket Pick and Place cover must withstand 15 cycles of insertion and removal.
2.6

Markings

There are three markings on the socket:
• LGA1356: Font type is Helvetica Bold - minimum 6 point (2.125 mm).
• Manufacturer's insignia (font size at supplier's discretion).
• Lot identification code (allows traceability of manufacturing date and location).
All markings must withstand 260 °C for 40 seconds (typical reflow/rework profile)
without degrading, and must be visible after the socket is mounted on the
motherboard.
LGA1356 and the manufacturer's insignia are molded or laser marked on the side wall.
Intel® Xeon® Processor E5-2400 Product Family
Thermal/Mechanical Design Guide
Appendix C.
Section 3.2 for the calculated IHS height above the motherboard.
Table 4-4 must be met when mated in the 1st and 30th
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