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Quality and Reliability Requirements
6
Quality and Reliability
Requirements
6.1
Test Conditions
Test Conditions, Qualification and Visual Criteria vary by customer.
Socket Test Conditions are provided in the LGA1366 Socket Validation Reports, and
LGA1356 Addendum and are available from socket suppliers listed in
6.2
Intel Reference Component Validation
Intel tests reference components both individually and as an assembly on mechanical
test boards, and assesses performance to the envelopes specified in previous sections
by varying boundary conditions.
While component validation shows that a reference design is tenable for a limited range
of conditions, customers need to assess their specific boundary conditions and perform
reliability testing based on their use conditions.
Intel reference components are also used in board functional tests to assess
performance for specific conditions.
6.2.1
Board Functional Test Sequence
Each test sequence should start with components (baseboard, heatsink assembly, and
so on) that have not been previously submitted to any reliability testing.
The test sequence should always start with a visual inspection after assembly and
BIOS/Processor/memory test. The stress test should be then followed by a visual
inspection and then BIOS/Processor/memory test.
6.2.2
Post-Test Pass Criteria
The post-test pass criteria are:
1. No significant physical damage to the heatsink and retention hardware.
2. Heatsink remains seated and its bottom remains mated flat against the IHS
surface. No visible gap between the heatsink base and processor IHS. No visible tilt
of the heatsink with respect to the retention hardware.
3. No signs of physical damage on baseboard surface due to impact of heatsink.
4. No visible physical damage to the processor package.
5. Successful BIOS/Processor/memory test.
6. Thermal compliance testing to demonstrate that the case temperature specification
can be met.
Intel® Xeon® Processor E5-2400 Product Family
Thermal/Mechanical Design Guide
Appendix
A.
45
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