Table Of Contents - Intel Xeon E5-2400 Thermal/Mechanical Design Manual

Contents
1 Introduction .............................................................................................................. 9
1.1 References ....................................................................................................... 10
1.2 Definition of Terms ............................................................................................ 10
2 LGA1356 Socket ...................................................................................................... 13
2.1 Board Layout .................................................................................................... 15
2.2 Attachment to Motherboard ................................................................................ 16
2.3 Socket Components........................................................................................... 16
2.3.1 Socket Body Housing .............................................................................. 16
2.3.2 Solder Balls ........................................................................................... 16
2.3.3 Contacts ............................................................................................... 17
2.3.4 Pick and Place Cover............................................................................... 17
2.4 Package Installation / Removal ........................................................................... 18
2.4.1 Socket Standoffs and Package Seating Plane.............................................. 19
2.5 Durability ......................................................................................................... 19
2.6 Markings .......................................................................................................... 19
2.7 Component Insertion Forces ............................................................................... 20
2.8 Socket Size ...................................................................................................... 20
2.9 LGA1356 Socket NCTF Solder Joints..................................................................... 20
3 Independent Loading Mechanism (ILM) and Back Plate........................................... 23
3.1 Design Concept................................................................................................. 23
3.1.1 ILM Assembly Design Overview ................................................................ 23
3.1.2 ILM Back Plate Design Overview ............................................................... 24
3.1.3 Durability .............................................................................................. 24
3.2 Assembly of ILM to a Motherboard....................................................................... 25
3.3 ILM Cover ........................................................................................................ 27
4 LGA1356 Socket, ILM and Back Plate Electrical, Mechanical, and Environmental
Specifications29
4.1 Component Mass............................................................................................... 29
4.2 Package/Socket Stackup Height .......................................................................... 29
4.3 Socket Maximum Temperature ............................................................................ 29
4.4 Loading Specifications........................................................................................ 30
4.5 Electrical Requirements ...................................................................................... 30
4.6 Environmental Requirements .............................................................................. 31
5 Thermal Solutions ................................................................................................... 33
5.1 Boundary Conditions.......................................................................................... 33
5.2 Assembly ......................................................................................................... 35
5.2.1 Thermal Interface Material (TIM) .............................................................. 36
5.3 Structural Considerations ................................................................................... 36
5.4 Thermal Design................................................................................................. 36
5.4.1 Thermal Characterization Parameter ......................................................... 36
5.5 Fan Speed Control ............................................................................................. 37
5.5.1 Fundamentals ........................................................................................ 37
5.6 Thermal Features .............................................................................................. 37
5.6.1 TCONTROL and DTS Relationship.............................................................. 38
5.6.2 Short Duration TCC Activation and Catastrophic Thermal
Management for Intel® Xeon® Processor E5-2400 Product Family................ 39
5.6.3 Intel® Turbo Boost Technology ................................................................ 40
5.7 Thermal Guidance ............................................................................................. 40
5.7.1 Thermal Excursion.................................................................................. 40
5.7.2 Absolute Processor Temperature .............................................................. 40
Intel® Xeon® Processor E5-2400 Product Family
Thermal/Mechanical Design Guide
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