Socket Standoffs And Package Seating Plane; Durability; Package Installation / Removal Features - Intel Core i7-800 Specifications

LGA1156 Socket
.
Figure 3-6.

Package Installation / Removal Features

Package
Pin 1
Indicator
3.4.1

Socket Standoffs and Package Seating Plane

Standoffs on the bottom of the socket base establish the minimum socket height after
solder reflow and are specified in
Similarly, a seating plane on the top-side of the socket establishes the minimum
package height. See
3.5

Durability

The socket must withstand 20 cycles of processor insertion and removal. The max
chain contact resistance from
cycles.
The socket Pick and Place cover must withstand 15 cycles of insertion and removal.
Thermal/Mechanical Specifications and Design Guidelines
Alignment
Post
(2 Places)
Appendix
Section 5.2 for the calculated IHS height above the motherboard.
Table 5-4 must be met when mated in the 1st and 20th
Orientation
Notch
(2 Places)
Finger
Access
(2 Places)
Pin 1
Chamfer
C.
23