Intel Xeon E5-2400 Thermal/Mechanical Design Manual page 11

Introduction
Table 1-2. Terms and Descriptions (Sheet 2 of 2)
Term
T
CASE
T _
CASE MAX
TCC
T
CONTROL
TDP
Thermal Monitor
Thermal Profile
TIM
T
LA
T
SA
U
Intel® Xeon® Processor E5-2400 Product Family
Thermal/Mechanical Design Guide
The case temperature of the processor measured at the geometric center of the topside
of the IHS.
The maximum case temperature as specified in a component specification.
Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature
by using clock modulation and/or operating frequency and input voltage adjustment
when the die temperature is very near its operating limits.
T is a static value below TCC activation used as a trigger point for fan speed
CONTROL
control.
Thermal Design Power: Thermal solution should be designed to dissipate this target
power level. TDP is not the maximum power that the processor can dissipate.
A power reduction feature designed to decrease temperature after the processor has
reached its maximum operating temperature.
Line that defines the temperature specification of a processor at a given power level.
Thermal Interface Material: The thermally conductive compound between the heatsink
and the processor case. This material fills the air gaps and voids, and enhances the
transfer of the heat from the processor case to the heatsink.
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan inlet
for an active heatsink.
The system ambient air temperature external to a system chassis. This temperature is
usually measured at the chassis air inlets.
A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U
equals 3.50 in, etc.
Description
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