Table of Contents
Advertisement
Table 5-2.
Performance Expectations in Compact Electronics Bay (CEB)
Parameter
Ψ
2
CA
Airflow
3
System height
(form factor)
Heatsink
volumetric
Heatsink
technology
Notes:
1. Local ambient temperature of the air entering the heatsink.
2. Max target (mean + 3 sigma + offset) for thermal characterization parameter
3. Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in
inches H
4. Reference system configuration. Processor is downstream from processor in CEB (Compact
Electronics Bay). With the values above, the 25.5mm tall heatsink can meet the processor thermal
specifications in Intel's Reference Design 10.5x12 inches CEB board. However, these CEB values are
not used to generate processor thermal specifications. Ducting is utilized to direct airflow.
5. Dimensions of heatsink do not include socket or processor.
6. Heatsink height + socket/processor height
Constraints (36 mm) in EEB Specification 2011, and with Maximum Component Height (33.5 mm)
in SSI Compute Blade Specification, both at http://www.ssiforum.org.
7. Passive heatsinks. PCM45F thermal interface material.
Table 5-1
determine Ψ
Figure
5-1. Heatsink detailed drawings are in
Figure 5-1.
Best-fit Equations
34
o
o
0.273
C/W
0.265
4
5
7
O.
2
and
Table 5-2
specify Ψ
and pressure drop targets for other airflows, use Best-fit equations in
CA
Value
o
o
C/W
0.264
C/W
0.278
C/W
13 CFM @ 0.32" dP
1U (CEB)
90 x 90 x 25.5 mm (1U/SSI blade)
Cu base, Al fins
(Table
4-2) complies with TEB 1U Rack Height
and pressure drop targets for specific airflows. To
CA
Appendix
Intel® Xeon® Processor E5-2400 Product Family
Thermal Solutions
o
0.265
C/W (8-core),
0.269
o
C/W (6-core)
6
(Section
5.4.1).
A.
Thermal/Mechanical Design Guide
Advertisement
Table of Contents
