Socket, Ilm And Back Plate; Lga1356 Socket, Ilm And Back Plate - Intel Xeon E5-2400 Thermal/Mechanical Design Manual

Table A-3. Suppliers for the Alternative Thermal Solution (Sheet 3 of 3)
Assembly Component
Assembly, Tower
Heatsink, Alternative
Tower URS Heatsink
Pedestal/2U
Assembly,
Active
Heatsink
Heatsink
Notes:
1) Standard - Design and technology similar to Intel Reference or Collaboration designs, however, may not meet thermal
requirements for all processor SKUs.
2) Performance - 1U Heatsink designed with premium materials or technology expected to provide optimum thermal performance
for all processor SKUs.
3) Low Cost - 2U Cost-Optimized Heatsink, expected to meet thermal targets for lower power processor SKUs.
A.1.4

Socket, ILM and Back Plate

The LGA1356 Socket, ILM and Back Plate are described in
respectively. Socket mechanical drawings are provided in
models are listed in
Table A-4.

LGA1356 Socket, ILM and Back Plate

Item
ILM Assembly
ILM Assembly
with ILM Cover
ILM Cover
Back Plate
LGA1356
Socket
Supplier Contact Info
50
Description
TaiSol Corporation
Standard 1A0-9051000960-A
www.Taisol.com
Standard
www.Thermaltake.com
Asia Vital Components
Standard
www.avc.com.tw
Dynatron Corporation* (Top
Motor/Dynaeon)
Active
www.Dynatron-Corp.com
Table 1-1.
Intel PN Foxconn
D92428-003 PT44L13-4102
G13666-001 PT44L13-4111
G14954-001 012-1000-5776
D92433-002 PT44P12-4104
E81085-001 PE135627-4371-01H
Julia Jiang
juliaj@foxconn.com
408-919-6178
Supplier PN
Thermaltake
CL-P0485
SS40W00001
G555
Chapter 2
Appendix
Tyco
1554105-1
1-1554105-1
1-2134711-1
1981467-2
1554116-1
Billy Hsieh
billy.hsieh@tycoel
ectronics.com
+81 44 844 8292
§
Intel® Xeon® Processor E5-2400 Product Family
Component Suppliers
Thermal Capability
up to 95W capable
up to 95W capable
up to 95W capable
up to 95W capable
and Chapter 3,
C. Mechanical
Molex
475939000
475939070
475930403
475937000
475943001
Carol Liang
carol.liang@molex.com
Tel #: +86-21-5048-0889 ext
3301
Thermal/Mechanical Design Guide