Intel Agilex Temperature Monitor Design Guidelines - Intel Agilex User Manual

4.3.2. Intel Agilex Temperature Monitor Design Guidelines

You can measure the on-chip temperature of the core fabric or transceiver tiles
through the remote TSDs while the device is powered on or powered off. However, the
local temperature sensors are available only after the device is powered up and
configured.
• Connect the remote TSD pins to external temperature sensing devices to monitor
the on-chip temperature.
•
Keep the resistance of both board traces to the remote TSD
than 0.2 Ω.
• Route both traces in equal lengths and shield them.
• Intel recommends a 10-mils width and space for both traces.
• Route both traces through the most minimum number of vias and crossunders
possible to minimize the thermocouple effects.
• Ensure that the number of vias for both traces are the same.
•
To avoid coupling, insert a
high-frequency toggling signals, such as clocks and I/O signals.
• To filter high-frequency noise, place an external capacitor between the traces close
to the external sensors.
•
If you use only the local temperature sensors, you can leave the remote TSD
and
n
For details about device specifications and connection guidelines, refer to the external
temperature sensor manufacturer's documentation.
® ™
Intel Agilex Power Management User Guide
16
GND
pins unconnected.
4. Intel Agilex Sensor Monitoring System
plane between the remote TSD pins traces and
UG-20215 | 2019.04.02
and pins to less
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p
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