Operating Altitude - HP FlexFabric 12500E Installation Manual

Maintain appropriate humidity in your equipment room, as described in
Table 2 Humidity requirements
Item
Operating humidity (noncondensing)
Storage humidity (noncondensing)

Operating altitude

Table 3 Operating altitude requirements
Item
Operating altitude
Cleanness
Dust buildup on the chassis might result in electrostatic adsorption, which causes poor contact of metal
components and contact points, especially when indoor relative humidity is low. In the worst case,
electrostatic adsorption can cause communication failure.
Table 4 Dust concentration limit in the equipment room
Substance
Dust particles
NOTE:
Dust particle diameter ≥ 5 μm
The equipment room must also meet strict limits on salts, acids, and sulfides to eliminate corrosion and
premature aging of components, as shown in
Table 5 Harmful gas limits in the equipment room
Gas
SO
2
H S
2
NO
2
NH
3
Cl
2
EMI
All electromagnetic interference (EMI) sources, from outside or inside of the switch and application
system, adversely affect the switch in a conduction pattern of capacitance coupling, inductance coupling,
Specifications
5% to 95%
5% to 95%
Specifications
≤ 4000 m (13123.36 ft) (available altitude)
≤ 3000 m (9842.52 ft) (certificated altitude)
Concentration limit (particles/m
≤ 3 x 10 4 (no visible dust on the tabletop over three days)
Table 5.
Average (mg/m )
3
0.3
0.1
0.004
1.0
0.1
4
Table 2.
3 )
Max. (mg/m )
3
1.0
0.5
0.15
3
0.3