Thermal Characteristics; Reference Document; Selecting The Product Temperature Range; Table 74. Package Thermal Characteristics - STMicroelectronics STM32F042F4 Manual

STM32F042x4 STM32F042x6
7.8

Thermal characteristics

The maximum chip junction temperature (T
Table 21: General operating
The maximum chip-junction temperature, T
using the following equation:
Where:
•
T max is the maximum ambient temperature in °C,
A
•
Θ
JA
•
P max is the sum of P
D
•
P
INT
internal power.
P max represents the maximum power dissipation on output pins where:
I/O
P
I/O
taking into account the actual V
application.
Symbol
Θ
JA
7.8.1

Reference document

JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
7.8.2

Selecting the product temperature range

When ordering the microcontroller, the temperature range is specified in the ordering
information scheme shown in
conditions.
T
J
is the package junction-to-ambient thermal resistance, in °C/W,
INT
max is the product of I
max = Σ (V × I ) + Σ ((V
OL OL

Table 74. Package thermal characteristics

Thermal resistance junction-ambient
LQFP48 - 7 mm x 7 mm
Thermal resistance junction-ambient
UFQFPN48 - 7 mm x 7 mm
Thermal resistance junction-ambient
WLCSP36 2.6 mm x 2.7 mm
Thermal resistance junction-ambient
LQFP32 - 7 mm x 7 mm
Thermal resistance junction-ambient
UFQFPN32 - 5 mm x 5 mm
Thermal resistance junction-ambient
UFQFPN28 - 4 mm x 4 mm
Thermal resistance junction-ambient
TSSOP20 - 6.5 mm x 6.4 mm
Section 8: Ordering
DocID025832 Rev 5
max) must never exceed the values given in
J
max, in degrees Celsius, may be calculated
J
max = T max + (P max x Θ
A D
max and P max (P
I/O
and V , expressed in Watts. This is the maximum chip
DD DD
– V ) × I
DDIOx OH
/ I and V / I
OL OL OH OH
Parameter
information.
Package information
)
JA
max = P max + P
D INT
),
OH
of the I/Os at low and high level in the
Value
55
33
64
57
38
118
76
max),
I/O
Unit
°C/W
111/117
113