Tssop20 Package Information; Table 73. Tssop20 Package Mechanical Data; Figure 51.Tssop20 Package Outline - STMicroelectronics STM32F042F4 Manual

Package information
7.7

TSSOP20 package information

TSSOP20 is a 20-lead thin shrink small-outline, 6.5 x 4.4 mm, 0.65 mm pitch, package.
1. Drawing is not to scale.
Symbol
A
A1
A2
b
c
(2)
D
E
(3)
E1
e
L
108/117

Figure 51.TSSOP20 package outline

Table 73. TSSOP20 package mechanical data

millimeters
Min. Typ.
- -
0.050 -
0.800 1.000
0.190 -
0.090 -
6.400 6.500
6.200 6.400
4.300 4.400
- 0.650
0.450 0.600
DocID025832 Rev 5
STM32F042x4 STM32F042x6
Max. Min.
1.200 -
0.150 0.0020
1.050 0.0315
0.300 0.0075
0.200 0.0035
6.600 0.2520
6.600 0.2441
4.500 0.1693
- -
0.750 0.0177
(1)
inches
Typ. Max.
- 0.0472
- 0.0059
0.0394 0.0413
- 0.0118
- 0.0079
0.2559 0.2598
0.2520 0.2598
0.1732 0.1772
0.0256 -
0.0236 0.0295