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STM32F042x4 STM32F042x6
7.2
UFQFPN48 package information
UFQFPN48 is a 48-lead, 7x7 mm, 0.5 mm pitch, ultra-thin fine-pitch quad flat package.
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and
solder this back-side pad to PCB ground.
Figure 36. UFQFPN48 package outline
DocID025832 Rev 5
Package information
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