Wlcsp36 Package Information; Table 68. Wlcsp36 Package Mechanical Data; Figure 39. Wlcsp36 Package Outline - STMicroelectronics STM32F042F4 Manual

Package information
7.3

WLCSP36 package information

WLCSP36 is a 36-ball, 2.605 x 2.703 mm, 0.4 mm pitch wafer-level chip-scale package.
1. Drawing is not to scale.
Symbol
A
A1
A2
(2)
A3
(3)
b
D
E
e
e1
e2
96/117

Figure 39. WLCSP36 package outline

Table 68. WLCSP36 package mechanical data

millimeters
Min Typ
0.525 0.555
- 0.175
- 0.380
- 0.025
0.220 0.250
2.570 2.605
2.668 2.703
- 0.400
- 2.000
- 2.000
DocID025832 Rev 5
STM32F042x4 STM32F042x6
Max Min
0.585 0.0207
- -
- -
- -
0.280 0.0087
2.640 0.1012
2.738 0.1050
- -
- -
- -
(1)
inches
Typ Max
0.0219 0.0230
0.0069 -
0.0150 -
0.0010 -
0.0098 0.0110
0.1026 0.1039
0.1064 0.1078
0.0157 -
0.0787 -
0.0787 -