Figure 45. Ufqfpn32 Package Outline - STMicroelectronics STM32F042F4 Manual

Arm-based 32-bit mcu, up to 32 kb flash, crystal-less usb fs 2.0, can, 9 timers, adc and comm. interfaces, 2.0 - 3.6 v

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Package information

1. Drawing is not to scale.

2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.

3. There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device

ground and must be connected. It is referred to as pin 0 in Table: Pin definitions.

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Figure 45. UFQFPN32 package outline

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STM32F042x4 STM32F042x6

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