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Summary of Contents for Texas Instruments TMS320C44 DSP
- Page 1 TMS320C44 DSP Packaging Guide 1997 Digital Signal Processing Solutions...
- Page 2 Printed in U.S.A., June 1997 SPRZ114...
- Page 3 TMS320C44 DSP Packaging Guide Literature Number: SPRZ114 June 1997 Printed on Recycled Paper...
- Page 4 IMPORTANT NOTICE Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied on is current.
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Page 5: Table Of Contents
Packaging Instructions TI has developed handling and packing techniques to protect the leads from handling damage at the device level, in trays, and in packed trays (boxed) for shipping. These techniques have been translated from TI manufacturing spec- ifications, and they are discussed in this booklet as suggested guidelines for your handling operations. -
Page 6: Introduction
Introduction Introduction The TMS320C44PDB DSP device family uses the 304 PowerQuad II pack- age. The 304 PowerQuad II package is a fine-pitch, high-pin-count package that contains a heavy copper slug for heat dissipation. The package is very heavy due to the copper heat slug. The package weight in conjunction with the fine pitch and high pin count makes the package particularly susceptible to lead damage. -
Page 7: Shipping And Storage
Shipping and Storage Shipping and Storage TI qualification testing has now been completed. This testing, which included multiple dead drops of up to three feet, indicates that this packaging procedure sufficiently protects and preserves original lead dress integrity. The testing re- sults also reinforced our belief that such extraordinary packing procedures should be maintained until the device is safely mounted. - Page 8 Shipping and Storage Therefore, if it is necessary to unpack devices prior to end use, Texas Instru- ments strongly recommends that all remaining devices and trays be repacked in the same manner. The repacking should occur immediately after the early removal of any devices or trays.
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Page 9: Packing Devices Into Trays
Packing Devices Into Trays Packing Devices Into Trays Using the equipment and materials specified, follow the procedure below to pack the devices into the JEDEC tray. Equipment Grounded workstation Worktable with grounded conductive mats on top surface Static-control wrist straps and ground wires Vacuum pencil Virtual part number: v8901-a-esd Nepenthe part number: NEP3-VAC2... - Page 10 Packing Devices Into Trays Figure 2. Pin Orientation in JEDEC Tray Pin 1 Device JEDEC tray...
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Page 11: Packing Trays Into Tray Bundles
Packing Trays Into Tray Bundles Packing Trays Into Tray Bundles Using the equipment and materials specified, follow the steps below to as- semble the tray bundles. Equipment Grounded workstation Worktable with grounded conductive mats on top surface Static-control wrist straps and ground wires Semi-automatic strapper –... - Page 12 Packing Trays Into Tray Bundles Step 2: Place five straps around the tray bundle as shown in Figure 3. Figure 3. Tray Bundle Straps Empty tray Tray notch Step 3: Center a conductive cardboard sheet on both the top and bottom of the bundle.
- Page 13 Packing Trays Into Tray Bundles Step 5: Place the tray bundle into a conductive dry-pack bag, add dessicants and a humidity-indicator card, and seal it in the standard procedure. Dry-Pack Bag Requirements This bag contains moisture-sensitive devices. The shelf life in sealed bag is 12 months at C and 90% rela- tive humidity (RH).
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Page 14: Packing The Tray Bundles Into The Inner Box
Packing the Tray Bundles Into the Inner Box Packing the Tray Bundles Into the Inner Box Using the equipment and materials specified, follow the steps below to pack the tray bundles into the inner box. Materials Cardboard sleeves Olin part number: PXHIT-0003 (20) TI part number: 1041370–0104 Conductive cardboard sleeves (20) Olin part number: PXHIT-0002... - Page 15 Packing the Tray Bundles Into the Inner Box Figure 5. Packing the Inner Box Inner box (JEDEC tray box) Conductive Tray bundle cardboard sleeve (inside of dry pack bag) Cardboard sleeve Step 4: After placing the bundle inside the the box, close the box and secure it with strapping (3/8 or 1/2 inch polyethylene) in two places (one at each end) or with tape (Mylar or reinforced paper tape) along the open edges of the box flaps.
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Page 16: Packing The Inner Box Into The Outer Box
Packing the Inner Box Into the Outer Box Packing the Inner Box Into the Outer Box Using the equipment and materials specified, follow the steps below to as- semble and pack the outer box. Equipment Manual box stapler (optional) Scissors Materials Outer box Corrugated fiberboard... - Page 17 Packing the Inner Box Into the Outer Box Step 6: Place the inner box face up in the center of the bubble wrap and push it down into the outer box. Equal lengths of wrap should emerge from opposite sides of the box. Do not allow bunching except in the cor- ners.
- Page 19 IMPORTANT NOTICE Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied on is current.
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