Processor Storage Specifications; Storage Conditions - Intel BX80605X3440 - Quad Core Xeon X3440 Reference

Lga1156 socket thermal/mechanical specifications and design guidelines
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2.2

Processor Storage Specifications

Table 2-4
and minimum temperatures and relative humidity. These conditions should not be
exceeded in storage or transportation.
.
Table 2-4.

Storage Conditions

Parameter
T
ABSOLUTE STORAGE
T
SUSTAINED STORAGE
RH
SUSTAINED STORAGE
TIME
SUSTAINED STORAGE
Notes:
1.
Refers to a component device that is not assembled in a board or socket that is not to be electrically
connected to a voltage reference or I/O signals.
2.
Specified temperatures are based on data collected. Exceptions for surface mount reflow are specified in
applicable JEDEC standard and MAS document. Non-adherence may affect processor reliability.
3.
T
ABSOLUTE STORAGE
moisture barrier bags or desiccant.
4.
Intel
®
given as an example only (Non-Operating Temperature Limit: -40 °C to 70 °C, Humidity: 50% to 90%,
non-condensing with a maximum wet bulb of 28 °C). Post board attach storage temperature limits are not
specified for non-Intel branded boards.
5.
The JEDEC, J-JSTD-020 moisture level rating and associated handling practices apply to all moisture
sensitive devices removed from the moisture barrier bag.
6.
Nominal temperature and humidity conditions and durations are given and tested within the constraints
imposed by T
18
includes a list of the specifications for device storage in terms of maximum
The non-operating device storage
temperature. Damage (latent or otherwise)
may occur when subjected to for any length of
time.
The ambient storage temperature limit (in
shipping media) for a sustained period of time.
The maximum device storage relative humidity
for a sustained period of time.
A prolonged or extended period of time;
typically associated with customer shelf life.
applies to the unassembled component only and does not apply to the shipping media,
branded board products are certified to meet the following temperature and humidity limits that are
and customer shelf life in applicable Intel box and bags.
SUSTAINED
Package Mechanical and Storage Specifications
Description
§
Thermal/Mechanical Specifications and Design Guidelines
Min
Max
Notes
-55 °C
125 °C
1, 2,
3
-5 °C
40 °C
4,
5
60% @ 24 °C
5,
6
0
6
6
Months
Months

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