Durability; Package Installation / Removal Features - Intel BX80605X3440 - Quad Core Xeon X3440 Reference

.
Figure 3-7.

Package Installation / Removal Features

3.5.1 Socket Standoffs and Package Seating Plane
Standoffs on the bottom of the socket base establish the minimum socket height after
solder reflow and are specified in
Similarly, a seating plane on the top-side of the socket establishes the minimum
package height. See
3.6

Durability

The socket must withstand 20 cycles of processor insertion and removal. The max
chain contact resistance from
cycles.
The socket Pick and Place cover must withstand 15 cycles of insertion and removal.
26
Package
Pin 1
Indicator
Alignment
Post
(2 Places)
Section 5.2
Table 5-4
Orientation
Notch
(2 Places)
Pin 1
Chamfer
Appendix C.
for the calculated IHS height above the motherboard.
must be met when mated in the 1st and 20th
Thermal/Mechanical Specifications and Design Guidelines
LGA1156 Socket
Finger
Access
(2 Places)