Assembly; Collaboration Heatsink Assembly - Intel BX80605X3440 - Quad Core Xeon X3440 Reference

Lga1156 socket thermal/mechanical specifications and design guidelines

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1U Collaboration Thermal Solution

8.3

Assembly

Figure 8-3.

1U Collaboration Heatsink Assembly

The assembly process for the 1U collaboration heatsink with application of thermal

interface material begins with placing back plate in a fixture. The motherboard is

aligned with fixture.

Next is to place the heatsink such that the heatsink fins are parallel to system airflow.

While lowering the heatsink onto the IHS, align the four captive screws of the heatsink

to the four holes of motherboard.

Using a #2 Phillips driver, torque the four captive screws to 8 inch-pounds.

This assembly process is designed to produce a static load compliant wi t h the minimum

preload requirement (26.7lbf) for the selected TIM and to not exceed the package

design limit (50 lbf).

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Xeon 3400 series