Board Layout; Lga1156 Socket Land Pattern (Top View Of Board) - Intel BX80605X3440 - Quad Core Xeon X3440 Reference

LGA1156 Socket
3.1

Board Layout

The land pattern for the LGA1156 socket is 36 mils X 36 mils (X by Y) within each of the
two L-shaped sections. Note that there is no round-off (conversion) error between
socket pitch (0.9144 mm) and board pitch (36 mil) as these values are equivalent. The
two L-sections are offset by 0.9144 mm (36 mil) in the x direction and 3.114 mm
(122.6 mil) in the y direction (see
land to PCB land offset that ensures a single PCB layout for socket designs from the
multiple vendors.
Figure 3-3.

LGA1156 Socket Land Pattern (Top View of Board)

30 30 30
28 28 28
26 26 26
24 24 24
22 22 22
20 20 20
18 18 18
16 16 16
14 14 14
12 12 12
10 10 10
8 8 8
6 6 6
4 4 4
2 2 2
Thermal/Mechanical Specifications and Design Guidelines
A A C C E E G G J J L L
B B D D F F H H K K M M
36mil (0.9144 mm) 36mil (0.9144 mm)
29 29 29
27 27 27
25 25 25
23 23 23
21 21 21
19 19 19
17 17 17
15 15 15
13 13 13
11 11 11
9 9 9
7 7 7
5 5 5
3 3 3
1 1 1
A A C C E E G G J J L L N N
B B D D F F H H K K M M
Figure 3-3). This was to achieve a common package
N N R R U U W AA AC AE AG AJ AL AN AR AU AW W AA AC AE AG AJ AL AN AR AU AW
P P T T V V Y Y AB AD AF AH AK AM AP AT AV AY AB AD AF AH AK AM AP AT AV AY
R R U U W AA AC AE AG AJ AL AN AR AU AW W AA AC AE AG AJ AL AN AR AU AW
P P T T V V Y Y AB AD AF AH AK AM AP AT AV AY AB AD AF AH AK AM AP AT AV AY
39 39
37 37
35 35
33 33
31 31
29 29
27 27
25 25
23 23
21 21
19 19
17 17
15 15
13 13
11 11
122.6 mil (3.1144mm) 122.6 mil (3.1144mm)
40 40
38 38
36 36
34 34
32 32
30 30
28 28
26 26
24 24
22 22
20 20
18 18
16 16
14 14
12 12
21