Thermal Solution Design Process - Intel BX80605X3440 - Quad Core Xeon X3440 Reference

In the prior thermal specifications this region, DTS values greater than T
defined by the processor thermal profile. This required the user to estimate the
processor power and case temperature. Neither of these two data points are accessible
in real time for the fan speed control system. As a result the designer had to assume
the worst case T
7.3

Thermal Solution Design Process

Thermal solution design guidance for this specification is the same as with previous
products. The initial design needs to take into account the target market and overall
product requirements for the system. This can be broken down into several steps:
• Boundary condition definition
• Thermal design / modelling
• Thermal
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and drive the fans to accommodate that boundary condition.
AMBIENT
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Sensor Based Thermal Specification Design Guidance
Thermal/Mechanical Specifications and Design Guidelines
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