Heatsink Performance Curves - Intel BX80605X3440 - Quad Core Xeon X3440 Reference

Lga1156 socket thermal/mechanical specifications and design guidelines

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Figure 8-1.

1U Heatsink Performance Curves

Collaboration thermal solution Ψca(mean+3sigma) is computed to 0.319°C/W at the

airflow of 15 CFM. As the

thermal solution of this heatsink is calculated as:

where,

Y=Processor T

X=Processor Power Value (W)

Table 8-2

processor 3400 series(95W) TTV thermal profile specification. At the TDP(95W) with

local ambient of 40°C, there is a 2.4 °C margin.

Note:

Intel

Xeon

LGA1156 Processors.

Table 8-1

Y=0.319*X+40

Value (°C)

CASE

shows thermal solution performance is compliant with Intel

processor 3400 series (95W) TTV thermal profile is the worst case of

1U Collaboration Thermal Solution

shown when T

is 40 °C, equation representing

Xeon

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Xeon 3400 series