Thermal Specifications; Baseboard Power Header Placement Relative To Processor Socket; Fan Heatsink Power And Signal Specifications - Intel BX80605X3440 - Quad Core Xeon X3440 Reference

Lga1156 socket thermal/mechanical specifications and design guidelines
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Boxed Processor Specifications
Table 10-1. Fan Heatsink Power and Signal Specifications
+12 V: 12 volt fan power supply
IC:
• Maximum fan steady-state current draw
• Average steady-state fan current draw
• Maximum fan start-up current draw
• Fan start-up current draw maximum duration
SENSE: SENSE frequency
CONTROL
NOTES:
1. Baseboard should pull this pin up to 5 V with a resistor.
2. Open drain type, pulse width modulated.
3. Fan will have pull-up resistor for this signal to maximum of 5.25 V.
Figure 10-6. Baseboard Power Header Placement Relative to Processor Socket
10.4

Thermal Specifications

This section describes the cooling requirements of the fan heatsink solution used by the
boxed processor.
10.4.1
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a fan heatsink. However, meeting the
processor's temperature specification is also a function of the thermal design of the
entire system, and ultimately the responsibility of the system integrator. The processor
temperature specification is found in
fan heatsink is able to keep the processor temperature within the specifications (see
Table
6-1) in chassis that provide good thermal management. For the boxed processor
fan heatsink to operate properly, it is critical that the airflow provided to the fan
heatsink is unimpeded. Airflow of the fan heatsink is into the center and out of the
sides of the fan heatsink. Airspace is required around the fan to ensure that the airflow
through the fan heatsink is not blocked. Blocking the airflow to the fan heatsink
reduces the cooling efficiency and decreases fan life.
illustrate an acceptable airspace clearance for the fan heatsink. The air temperature
entering the fan should be kept below 40ºC. Again, meeting the processor's
temperature specification is the responsibility of the system integrator.
Thermal/Mechanical Specifications and Design Guidelines
Description
B
C
Chapter 6
Min
Typ
Max
11.4
12.0
12.6
1.2
0.5
2.2
1.0
2
pulses per fan
21
25
28
R110
[4.33]
of this document. The boxed processor
Figure 10-7
and
Unit
Notes
V
A
A
A
Second
1
revolution
2, 3
kHz
Figure 10-8
75

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