Package View - Intel BX80605X3440 - Quad Core Xeon X3440 Reference

2.1.1 Package Mechanical Drawing
Figure 2-2
mechanical drawings are in
design a thermal solution for the processor. These dimensions include:
1. Package reference dimensions with tolerances (total height, length, width, and so
forth.)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
5. Reference datums
6. All drawing dimensions are in mm.
Figure 2-2.

Package View

2.1.2 Processor Component Keep-Out Zones
The processor may contain components on the substrate that define component keep-
out zone requirements. A thermal and mechanical solution design must not intrude into
the required keep-out zones. Decoupling capacitors are typically mounted to either the
topside or land-side of the package substrate. See
out zones. The location and quantity of package capacitors may change due to
manufacturing efficiencies but will remain within the component keep-in. This keep-in
zone includes solder paste and is a post reflow maximum height for the components.
14
shows the basic package layout and dimensions. The detailed package
Appendix
37.5
Package Mechanical and Storage Specifications
D. The drawings include dimensions necessary to
Figure B-3
Thermal/Mechanical Specifications and Design Guidelines
and Figure B-4 for keep-