Thermal Solution; Processor 3400 Series (95W) - Intel BX80605X3440 - Quad Core Xeon X3440 Reference

Table 8-2. Comparison between TTV Thermal Profile and Thermal Solution Performance
for Intel
Power (W)
38
40
42
44
46
48
8.2

Thermal Solution

The collaboration thermal solution consists of two assemblies: heatsink assembly &
back plate.
Heatsink is designed with the Aluminum base and Aluminum stack fin, which
volumetrically is 95x95x24.85 mm. The heatpipe technology is used in the heatsink to
improve thermal conduction.
Heatsink back plate is a 1.8 mm thick flat steel plate with threaded studs for heatsink
attach. A clearance hole is located at the center of the heatsink backplate to
accommodate the ILM back plate. An insulator is pre-applied.
Note: Heatsink back plate herein is only applicable to 1U server. Desktop has a specific
heatsink back plate for its form factor.
62
® ®
Xeon Processor 3400 Series (95W) (Sheet 2 of 2)
Thermal
TTV T
CASE_MAX
Solution
(°C)
T
CASE_MAX
56.1
56.7
57.3
57.9
58.4
59.0
Power (W)
(°C)
52.1 88
52.8 90
53.4 92
54.0 94
54.7 95
55.3
1U Collaboration Thermal Solution
Thermal
TTV T
CASE_MAX
Solution
(°C)
T
CASE_MAX
70.6 68.1
71.2 68.7
71.8 69.3
72.4 70.0
72.7 70.3
(°C)