Processor Thermal Specifications - Intel Core i7 Extreme Edition Datasheet

Section 6.3. The temperature reported over PECI is always a negative value and
represents a delta below the onset of thermal control circuit (TCC) activation, as
indicated by PROCHOT# (see
implement fan speed control must be designed to use this data. Systems that do not
alter the fan speed only need to guarantee the thermal solution provides the Ψ
meets the TTV thermal profile specifications.
A single integer change in the PECI value corresponds to approximately 1 °C change in
processor temperature. Although each processors DTS is factory calibrated, the
accuracy of the DTS will vary from part to part and may also vary slightly with
temperature and voltage. In general, each integer change in PECI should equal a
temperature change between 0.9 °C and 1.1 °C.
Analysis indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP), instead of
the maximum processor power consumption. The Adaptive Thermal Monitor feature is
intended to help protect the processor in the event that an application exceeds the TDP
recommendation for a sustained time period. For more details on this feature, refer to
Section 6.2. Refer to the appropriate processor Thermal and Mechanical Design Guide
(see Section
environmental considerations.
Table 6-1.

Processor Thermal Specifications

Core
Processor
Frequency
i7-965 3.20 GHz
i7-940 2.93 GHz
i7-920 2.66 GHz
Notes:
1. These values are specified at V
the processor is not to be subjected to any static V
specified I
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at the TCC activation temperature.
3. These specifications are based on initial silicon characterization. These specifications may be further
updated as more characterization data becomes available.
4. Power specifications are defined at all VIDs found in
multiple VIDs for each frequency.
5. Target Ψ-ca Using the processor TTV (°C/W) is based on a T
6. Processor idle power is specified under the lowest possible idle state: processor package C6 state.
Achieving processor package C6 state is not supported by all chipsets. See Intel X58 Express Chipset
specifications for more details.
78
Section
1.2) for details on system thermal solution design, thermal profiles and
Thermal Idle
Design Power Power
6
(W) (W)
130 12
130 12
130 15
for all processor frequencies. Systems must be designed to ensure
CC_MAX
. Refer to the loadline specifications in
CC
6.2, Processor Thermal Features). Systems that
Minimum Maximum TTV
TTV T T
CASE CASE
(°C) (°C)
5
See Figure 6-1;
5
Table 6-2
5
and I combination wherein V
CC CC
Chapter 2.
Table 2-1. The processor may be shipped under
of 39 °C.
AMBIENT
Thermal Specifications
that
CA
Target Psi-ca
Using
Notes
Processor TTV
5
(°C/W)
0.222
1, 2, 3, 4,
0.222
5
0.222
exceeds V at
CC CC_MAX
Datasheet